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Wen J. Li, Xiaobo Zhang, Xinyu Meng, Yixiong Gao, Shuyu Fan, Tijun Li, Paul Kim Ho Chu (2024). Effects and modulation mechanism of crystal structure on residual stress of Cu films used for metallization. , 807, DOI: https://doi.org/10.1016/j.tsf.2024.140556.
