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Warpage Analysis and Optimization of Fan-Out Panel-Level Packaging with Chip-Last Process

Abstract

Electronic products are evolving toward miniaturization, high integration, and low prices, which requires us to improve production efficiency, reduce costs, and increase their high integration while ensuring the yield rate. Fan-Out Panel-Level Packaging (FOPLP) technology is meeting market requirements. However, warpage due to the shrinkage of the epoxy molding compound (EMC) during the post-curing stage and the mismatch in the coefficients of thermal expansion (CTE) of the individual encapsulation materials is an important issue in the production and application of this technology. Therefore, it is important to simulate and optimize the warpage of FOPLP before production and processing. In this paper, regarding the manufacturing process of Chip Last, the warpage of FOPLP in the post-curing stage is predicted by using finite element simulation. The equivalent parameter method is used to calculate the material parameters of the RDL layer, and increasing stress relief groove on the EMC, established a proportional reduction model of the structure of EMC-Chip-Temporary bonding layer-RDL-Carrier, to study the factors that affect warpage and stress in the post-curing stage of large panel-level fan-out packaging. The effects of material characteristics (CTE, Young's modulus), the proportion of copper volume in RDL, and stress relief groove on warpage were studied by controlling variable method. Experimental results show that Stress release grooves can reduce warping and thermal stress, and better optimization results can be obtained by changing the depth, width, and the total number of arrays of the groove structure. Increasing the volume fraction of copper in RDL or choosing materials with similar CTE can also reduce the warpage. This conclusion can be used to predict and improve plate-level warping by material selection before process production, and help to rationalize the package structure design to reduce warping.

article Proceedings Paper

date_range 2022

language English

link Link of the paper

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Su Xiaoxu

Yang Daoguo

Li Xiaojun

Tao Yongqi

He Mingzhuang

Zhang Yuhang

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Assessment of reinforced concrete building damages following the Kahramanmaraş earthquakes in Malatya, Turkey (February 6, 2023)

Abstract

Earthquakes of magnitude Mw = 7.7 and Mw = 7.6 hit the city of Kahramanmaraş (Turkey) on 6 February 2023. These earthquakes caused serious damage in 11 provinces in Turkey resulting in over 50,000 deaths and huge economic losses with the collapse of thousands of buildings. Two consecutive devastating earthquakes have severely damaged the reinforced concrete building stock located in Malatya. There are many reasons reinforced concrete structures suffer damage under the influence of seismic loads. These reasons can be listed as material and section properties that do not comply with earthquake codes, workmanship defects, ground parameters that are not considered and design errors, as seen in field investigations after earthquakes in Turkey in the past. In this research, a field study was conducted on reinforced concrete buildings damaged after the earthquakes in Malatya province. The causes of structural damages in reinforced concrete buildings between 6–26 years of age were assessed in terms of design and material defects. The structural damages were mainly caused due to insufficient stirrups in structural members, short column, strong beam–weak column, failures of infill walls, soft story type collapse, poor concrete quality, and reinforcement corrosion. In addition to the field investigation, the spectrum relationships created using raw acceleration data obtained from DEMP (Disaster and Emergency Management Presidency) stations in Malatya province were compared with the design response spectra.

article Article

date_range 2024

language English

link Link of the paper

Collapsed buildings

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