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Get Free AccessThe fabrication of complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels and allowing the solder to cool and solidify is demonstrated; after fabrication, the metallic structures can be flexed, bent, or twisted (see figure and cover). With this method it is possible to build flexible electronic circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic–microfluidic devices.
Adam Siegel, Derek A. Bruzewicz, Douglas B. Weibel, George M M Whitesides (2007). Microsolidics: Fabrication of Three‐Dimensional Metallic Microstructures in Poly(dimethylsiloxane). , 19(5), DOI: https://doi.org/10.1002/adma.200601787.
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Type
Article
Year
2007
Authors
4
Datasets
0
Total Files
0
Language
en
DOI
https://doi.org/10.1002/adma.200601787
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