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Get Free AccessElectrochemical scanning tunneling microscopy is proved to be a powerful tool for providing valuable topographic information to study in situ the local corrosion properties of polycrystalline materials. It was applied to analyze the susceptibility to intergranular corrosion of different types of grain boundaries of microcrystalline copper in HCl and combined with electron backscatter diffraction to link the observed corrosion differences to a specific type of grain boundary. The superior resistance to intergranular corrosion of coherent twin boundaries over random grain boundaries is demonstrated.
Esther Martinez-Lombardia, Linsey Lapeire, Vincent Maurice, Iris De Graeve, Kim Verbeken, Lorena H. Klein, Léo Kestens, Philippe Marcus, Herman Terryn (2014). In situ scanning tunneling microscopy study of the intergranular corrosion of copper. Electrochemistry Communications, 41, pp. 1-4, DOI: 10.1016/j.elecom.2014.01.007.
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Type
Article
Year
2014
Authors
9
Datasets
0
Total Files
0
Language
English
Journal
Electrochemistry Communications
DOI
10.1016/j.elecom.2014.01.007
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