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  5. Blockchain-Based Continuous Knowledge Transfer in Decentralized Edge Computing Architecture

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Article
English
2023

Blockchain-Based Continuous Knowledge Transfer in Decentralized Edge Computing Architecture

0 Datasets

0 Files

English
2023
Electronics
Vol 12 (5)
DOI: 10.3390/electronics12051154

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Yi-hu Xu
Yi-hu Xu

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Wenquan Jin
Yinan Xu
Yilin Dai
+1 more

Abstract

Edge computing brings computational ability to network edges to enable low latency based on deploying devices close to the environment where the data is generated. Nevertheless, the limitation of size and energy consumption constrain the scalability and performance of edge device applications such as deep learning, although, cloud computing can be adopted to support high-performance tasks with centralized data collection. However, frequently communicating with a central cloud server brings potential risks to security and privacy issues by exposing data on the Internet. In this paper, we propose a secure continuous knowledge transfer approach to improve knowledge by collaborating with multiple edge devices in the decentralized edge computing architecture without a central server. Using blockchain, the knowledge integrity is maintained in the transfer process by recording the transaction information of each knowledge improvement and synchronizing the blockchain in each edge device. The knowledge is a trained deep-learning model that is derived by learning the local data. Using the local data of each edge device, the model is continuously trained to improve performance. Therefore, each improvement is recorded as the contribution of each edge device immutably in the decentralized edge computing architecture.

How to cite this publication

Wenquan Jin, Yinan Xu, Yilin Dai, Yi-hu Xu (2023). Blockchain-Based Continuous Knowledge Transfer in Decentralized Edge Computing Architecture. Electronics, 12(5), pp. 1154-1154, DOI: 10.3390/electronics12051154.

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Publication Details

Type

Article

Year

2023

Authors

4

Datasets

0

Total Files

0

Language

English

Journal

Electronics

DOI

10.3390/electronics12051154

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